Warp analysis (Concept)

A Warp analysis is used to diagnose the cause of warping and recommend a solution, such as gate location changes, design parameter changes, or reduction of wall thickness variations.

Warp analysis is supported for Midplane,Dual Domain and 3D analysis technologies.

Warpage is affected greatly by fiber orientation. Warpage in an injection molded part is caused by variations in shrinkage that occur:

From region to region in the part.
Through the thickness of the part.
Parallel and perpendicular to the direction of material orientation.

Any attempt to predict the likelihood and amount of warpage for a particular component must first account for these shrinkage variations.

The material that is used influences the warpage of the part. Sometimes you must choose a material with low, uniform shrinkage to achieve dimensional accuracy. These materials are usually more expensive, but you may be able to use a cheaper material and save costs by observing shrinkage and warpage design principles.

Note: Differential shrinkage caused by fiber orientation is one of the main causes of warpage.

If you are analyzing a fiber-filled material you should turn on the Fiber analysis option in the Fill+Pack process settings.

Tip: If your material contains anisotropic matrix material properties, warpage and shrinkage values may be more accurately calculated using the Mori-Tanaka micomechanical model.